• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The invention relates to an arrangement and a method for suppressing condensation in housings (1) for electrical or electronic circuits. According to the invention, the housing (1) is provided with a ventilation element (6) to allow a gas exchange between inside and outside. It is in the housing (1) introduced a lot of a material (2), which is able to absorb as much moisture from the air (5) in the housing at falling temperatures, so that no condensation takes place. The material (2) can release the water again as the temperature rises, so that the process can be repeated as often as desired. The material (2) should ideally be able to absorb more moisture at lower temperatures than at high temperatures.
    公开号:AT516039A4
    申请号:T50728/2014
    申请日:2014-10-10
    公开日:2016-02-15
    发明作者:Ulrich Dipl Ing Klapper
    申请人:Ulrich Dipl Ing Klapper；
    IPC主号:
    专利说明:

    The invention relates to a method and a device or arrangement for preventing condensation forming closed housings for electrical circuits.
    With a certain amount of water in a certain amount of air, depending on the temperature, a certain relative humidity results. If the air cools down, the relative humidity increases until the water finally condenses. Depending on the surface condition, the exact point of condensation may still vary slightly in the vicinity of solid materials.
    In addition, in the long term, the relative humidities are equalized in different materials or gases.
    For example, in an environment with an average of 80% humidity in a moderately well-sealed housing, an 80% humidity will also be achieved inside. This leads to a seemingly paradoxical situation. In two identical housings which are moderately well sealed against the environment and of which a first housing is heated and of which a second housing is not heated is located in the first heated more water in the air than in the unheated second housing.
    One known suitable means of preventing condensation is to place the housing in the housing with a hydrophilic material, such as silica gel, and then seal the housing as best it can against the ingress of moisture. If the humidity in the enclosure rises later, the hydrophilic material absorbs moisture and keeps the humidity low enough to prevent condensation. Disadvantage of this solution is that no housing is absolutely tight, and thus over the years enters a saturation of the hydrophilic material and thus extinguishes its effect.
    A known remedy, however, is to replace externally replaceable silica gel depots so that they can be renewed every few years, which is very maintenance-intensive.
    Another very effective method is to allow some air circulation and to heat the incoming air by heating. As a result of the heating, the amount of water absorbed by the air remains the same, but the relative humidity decreases. The now heated air is so far away from the condensation point. A disadvantage of this method is that the air circulation also dust is introduced into the housing. Also can penetrate through the openings vermin into the housing.
    Condensation can also be prevented by casting, which displaces the air. Repairs to the circuits after casting, however, are almost impossible.
    One method to eliminate the influence of condensation on electronic circuits is the so-called "coating". of circuits. The circuits are coated with a paint that keeps the condensation away from the actual circuit. On the surface of the paint, the condensation does not cause any damage. However, repairs to the circuits are made considerably more difficult by the coating.
    Also known housing ventilation elements such as described in DE10053681 Al. Ventilation elements of this type provide a pressure equalization between the air in the housing and the environment, but also an approximation of the mean humidity. However, ventilation elements of this type can not prevent condensation from forming in the housings with rapid cooling and high humidity, possibly damaging the electronics inside.
    It is proposed in patent DE 971154 C to introduce substances into a housing, which keep the humidity in the housing as constant as possible, regardless of the temperature. For example, paper tapes or cellulose hydrate, better known under the brand name cellophane, are proposed. In DE 971154 C, it is proposed to complete the housing in an absolutely hermetically sealed manner so that over the years it would maintain the moisture initially set. Such a good seal is virtually impossible to manufacture, but above all, there is a huge additional stress for the seals to withstand the pressure and moisture differences due to the lack of pressure and moisture balance. There is a risk that the seals can not withstand this in the long term and then even water in liquid form can penetrate into the housing.
    Other known inventions such as DE 102010030367 Al or JP2002118372 collect the water in liquid form inside the housing, so that the water has already done the dreaded damage. In addition, by a material as described in the document DE 102010030367 Al could absorb the water in liquid form and from outside to inside also reaches water in liquid form from outside to inside.
    The problem of condensation in the phases of cooling in housings with electronic circuits is to be solved by this invention.
    If the housing is hermetically sealed, no water can enter the housing from the outside, and an initially low level of humidity can - at least theoretically - be maintained for years to come. Due to the hermetically sealed housing, however, no pressure compensation and no compensation of the water vapor partial pressure can take place. This poses a great deal of stress to the seals of the housing. If a ventilation element is used, pressure equalization takes place, but moisture can also get into the housing, but if it cools rapidly, it can not escape through the ventilation element quickly enough, condensation would then occur Episode.
    With the invention, this dilemma is to be solved, a ventilation possible but still a condensation can be prevented.
    According to claim 1, a closed housing is provided with a waterproof ventilation element. This venting element may include, for example, a Gore (R) Protective Vent. Such a ventilation element may comprise a very thin, breathable but completely waterproof membrane, which is able to allow a good gas exchange from the inside and outside but still reliably prevent the ingress of liquid water. Furthermore, in the housing for the electrical or electronic circuit, a material is introduced to regulate the moisture balance. This material must at least be able to absorb more moisture relative to air at a lower temperature than at a higher temperature. Ideally, however, the material should generally be able to absorb more water at lower temperatures than at higher temperatures. One could call such a material a thermo-hydro-absorption-reducing material. By cooling, the relative humidity in the material will decrease or at least increase less than in the air, while it naturally increases in the air. Due to this difference in relative humidity, the water migrates into the material and can not condense, provided that the surface of the material is large enough to allow this exchange fast enough relative to the cooling rate.
    The material must be introduced in sufficient quantity to absorb enough water as the temperature decreases and release it again as the temperature increases. The amount of material is therefore roughly proportional to the volume of air in the housing.
    Due to the waterproof housing ventilation element, the average humidity from outside and inside is adjusted to the long term. By keeping the difference of the water vapor partial pressure from the inside and outside small, the stress on the seals is kept as small as possible. The housing ventilation element relieves the seals in addition purely mechanically by the air pressure equalization from the inside and outside.
    So important is the combination of moisture-regulating material and ventilation element to prevent the formation of condensation on the one hand and on the other hand to allow a long-term approximation of the average humidity to minimize the stress on the seals by different water vapor partial pressure.
    According to claim 2, the ventilation element will comprise a waterproof, microporous and gas-permeable membrane. Suitable materials are also mentioned in DE 10053681 A1, a particularly suitable material may comprise polytetrafluoroethylene (PTFE), which may be highly fluorinated according to claim 3.
    In accordance with claim 4, the amount of material introduced is calculated appropriately in which for the amount of air present at, for example, 60% humidity, the amount of water dissolved in the air for the maximum expected working temperature is calculated. The higher the expected working temperature, the greater the amount of water that is dissolved in the air at a constant relative humidity. The amount of material can be calculated according to the requirements so that it can absorb at least as much water as calculated at 0 ° C.
    Since the water absorption capacity of different materials varies greatly, it is necessary to dispense with an indication of a concrete formula.
    According to claim 5, the introduced material is an organic material. Many organic materials have the desired properties to absorb more moisture at low temperatures than at high temperatures.
    According to claims 6 to 11, some particularly suitable appearing materials are listed separately. Pulp-based fabric may be cotton, for example. Wool is known to have a very good water absorbency. Partially deaerated wood is well suited for moisture regulation but has a higher flash point than untreated wood due to the pre-treatment by heating.
    According to claim 12, the material is mounted near the outer wall of the housing. Frequently, a cooling will take place so that the outer shell of the housing cools first.
    As a result, the material which is to absorb the moisture and absorb the better can be cooled first. The imbalance of relative humidity between material and
    Air during the cooling phase becomes even larger which accelerates the absorption of moisture into the material.
    According to claim 13, the material is introduced surface maximizing in the housing. The material may for example be configured with fins for moisture absorption or be folded like a factory roof. It can also be placed in very thin layers distributed in the housing.
    According to claims 14 and 15, protection is also claimed for methods with which according to claims 1 to 13 materials and ventilation elements are introduced into housing to achieve the desired effect described above.
    A preferred embodiment of the invention will be explained in more detail with reference to two figures.
    1 shows a housing 1 with thermo-hydro-absorption-reducing material 2 and a ventilation element. 6
    In Figure 2, a further embodiment of the invention is shown in the fin 7 which are connected to the outer wall of the housing 1 additional material 8 to cool more quickly.
    It is useful in a closed and preferably waterproof housing 1 for electrical or electronic circuits to install a ventilation element 6, which is waterproof, but still allows gas exchange between the gas or air volume inside with the outside world. This gas exchange allows a pressure equalization which reduces the mechanical stress on all seals. In addition, evolved gases can escape inside the housing 1, such as, for example, generated hydrogen gas, which can arise when charging batteries of different technologies or even when batteries of very many technologies fail. A detonating gas formation in the housing 1 is thus permanently prevented by the ventilation element 6.
    Figure 1 shows a schematic representation of the arrangement for preventing the formation of condensation. The closed housing 1 is shown in section. The housing 1 comprises a ventilation element 6 with a waterproof but gas-permeable membrane. To the housing 1, a material 2 may be attached to the outer wall, which can absorb the moisture from the air enclosed in the housing 1 5 with decreasing temperature. Schematically illustrated are boards 3 which can be equipped with electronic components 4.
    By the venting element 6, it also comes to a balance of relative humidity from the inside and outside. On the one hand, this leads to a desired effect, namely that the equalization of the mean moisture and the Wasserdampfpartialdruckunterschied between inside and outside equalizes and so a further stress factor is reduced to the seal, on the other hand, but also to the undesirable effect that when inside there is lower humidity as outside, water molecules migrate into the housing 1.
    Now, if the housing 1 is cooled, for example by switching off an electrical circuit 4 in the housing 1 and the sudden loss of loss and heating power in the housing 1 or by the cooling of the outside air, for example in the evening, it can at high relative humidity to condensation in the water Housing 1 come. Condensation is a major enemy of electronics 3 or 4, as it can be corrosive or otherwise corrosive to dirt or dust.
    According to the invention, therefore, a material 2 is introduced into the housing 1 in order to regulate the moisture balance. For this, this material 2 must be able to absorb more moisture at a lower temperature in relation to air than at a higher temperature. In return for hydrophilic materials such as silica gel, however, the material 2 must have reversible properties, so that at higher temperatures it can also release the water back to the environment in order to regenerate itself for the next cooling process. The material 2 may be, for example, cotton, wool, paper or wood. When the temperature remains constant for a relatively long time, the relative humidity is equalized so that the material 2 releases the moisture to the air 5 in the housing 1. When cooled, the relative humidity increases in the air 5, in a material 2 which can absorb more moisture as the temperature decreases, however, the relative humidity decreases, in a material 2, which can absorb more moisture relative to air only as the temperature decreases, increases relative humidity slower than that of the air. As a result of this uneven moisture distribution, the water then migrates from the air 5 into the material 2. The drying of the air 5 carried out in this way prevents condensation. The amount of material 2 introduced must be matched to the volume of air 5 in the housing 1. A large surface of the material 2 accelerates the approximation of the relative humidity between air 5 and material 2. The faster the cooling of the housing 1 can take place the larger the surface of the material 2 has to be made.
    In Figure 2, therefore, an embodiment with fins 7 is shown which are thermally connected to the outer wall of the housing 1 and coated with additional amounts of material 8. By this arrangement, on the one hand, the surface of the moisture-regulating material 2 and 8 is increased, on the other hand by the thermally connected to the outer wall of the housing 1 fins 7, the cooling of a portion of the material 8 significantly accelerated, whereby the difference in relative humidity in the housing 1 even greater is and the diffusion of moisture from the air 5 in the housing 1 in the material 8 is still accelerated.
    Housing 1 can also be understood to mean a switch cabinet, an electrical socket, a distribution box or similar housings of electronic or electrical circuits. It is also irrelevant whether it is a housing 1 for electrical circuits or whether really electronic circuits 4 are in the housing. While two embodiments have been described with reference to the figures, alternative or additional features may be used in other embodiments.
    For example, 3 hard paper plates or other material 2 can be attached with the desired properties between individual boards to give the air 5 on cooling in all parts of the housing 1, a good surface for the moisture exchange.
    An organic material 2 may also comprise a fabric or a textile fiber.
    The inside of a housing 1 could be coated with a layer to additionally achieve a thermal insulation to the outside world and thus to slow down the cooling and to gain more time for the moisture exchange.
    权利要求:
    Claims (15)
    [1]
    1. An arrangement for preventing condensation in closed housings (1) for electrical circuits (3), characterized in that the housing (1) comprises a ventilation element (6) and inside the housing (1) comprises a material (2) which is able to absorb more water at cool temperatures compared to air than at warm temperatures.
    [2]
    2. Arrangement according to claim 1, characterized in that the ventilation element (6) comprises a waterproof, microporous and gas-permeable membrane.
    [3]
    3. Arrangement according to claim 2, characterized in that the membrane in the ventilation element (6) is highly fluorinated.
    [4]
    4. Arrangement according to one of the preceding claims, characterized in that in the housing (1) at least as much material (2) is introduced, that it is able to absorb at 0 ° C as much water as at maximum working temperature and 60 % Humidity in the air (5) is present.
    [5]
    5. Arrangement according to one of the preceding claims, characterized in that in the housing (1) introduced material (2) comprises organic material.
    [6]
    6. Arrangement according to one of claims 1 to 5, characterized in that in the housing (1) introduced material (2) comprises pulp-based fabric.
    [7]
    7. Arrangement according to one of claims 1 to 5, characterized in that in the housing (1) introduced material (2) comprises wool.
    [8]
    8. Arrangement according to one of claims 1 to 5, characterized in that in the housing (1) introduced material (2) comprises paper.
    [9]
    9. Arrangement according to claim 8, characterized in that in the housing (1) introduced material (2) comprises hard paper.
    [10]
    10. Arrangement according to one of claims 1 to 5, characterized in that in the housing (1) introduced material (2) comprises wood.
    [11]
    11. Arrangement according to claim 10, characterized in that in the housing (1) introduced material (2) comprises teilentgastes wood.
    [12]
    12. Arrangement according to one of the preceding claims, characterized in that the material (2) for preventing the formation of condensation on directly on the inside of the outer shell of the housing (1) is arranged.
    [13]
    13. Arrangement according to one of the preceding claims, characterized in that the material (2) for preventing the formation of condensation is applied so that the surface of the material (2) is large.
    [14]
    14. A method for preventing condensation in closed housings for electrical circuits, characterized in that the housing (1) comprises a ventilation element (6) and in the housing (1) a material (2) is introduced, which is capable of deep Temperatures compared to air to absorb more water than at high temperatures.
    [15]
    15. A method for preventing condensation in closed housings for electrical circuits, characterized in that in a housing (1) which a ventilation element (6) comprises materials (2) to bring in such a way that arrangements according to claims 1 to 13 arise.
    类似技术:
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    同族专利:
    公开号 | 公开日
    AT516039B1|2016-02-15|
    WO2016054666A1|2016-04-14|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE971154C|1941-11-20|1958-12-18|Siemens Ag|Tightly encapsulated tropicalized circuit element or device|
    JP2002118372A|2000-10-05|2002-04-19|Sony Corp|Liquid absorbing device|
    JP2005305650A|2004-04-16|2005-11-04|Olympus Corp|Housing composed of compressed wood|
    DE102010030367A1|2010-06-22|2011-12-22|Sb Limotive Company Ltd.|Battery with a molded body made of a porous, moisture-absorbing material for moisture transport from the battery housing|
    DE10053681B4|2000-10-28|2004-08-26|W.L. Gore & Associates Gmbh|Housing with at least one EMI shielding plastic body or ventilation element and method for producing such a plastic body|
    NL1032115C2|2006-07-05|2008-01-08|Kamstrup B V|Housing and method for keeping an electronic circuit dry.|
    US20080122993A1|2006-11-29|2008-05-29|Sanyo Electric Co., Ltd.|Television image receiver|
    FR2947417B1|2009-06-25|2011-08-26|Centre Nat Rech Scient|ELECTRONIC DEVICE COMPRISING A MOISTURE ADSORPTION DEVICE|ES2890809T3|2016-06-20|2022-01-24|Schneider Electric Solar Inverters Usa Inc|Systems and methods for humidity control in utility-scale power inverters|
    DE102020100910A1|2020-01-16|2021-07-22|Audi Aktiengesellschaft|Arrangement for capillary media transport|
    法律状态:
    2020-08-15| MM01| Lapse because of not paying annual fees|Effective date: 20191010 |
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50728/2014A|AT516039B1|2014-10-10|2014-10-10|Arrangement for suppressing the formation of condensation in housings for electrical or electronic circuits|ATA50728/2014A| AT516039B1|2014-10-10|2014-10-10|Arrangement for suppressing the formation of condensation in housings for electrical or electronic circuits|
    PCT/AT2015/050237| WO2016054666A1|2014-10-10|2015-09-28|Arrangement for preventing the formation of condensed water|
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